Products
Industril sensor 4 layer yakasimba & flex pcb ine 2oz mhangura
| Layer | 4 akaturikidzana + 2 akaturikidzana anochinjika |
| Board ukobvu | 1.60MM+0.2mm |
| Material | FR4 tg150+Polymide |
| Mhangura ukobvu | 1 OZ(35um) |
| Surface Finish | ENIG Au Ukobvu 1um;Ni Ukobvu 3um |
| Min Hole(mm) | 0.21mm |
| Min Line Width(mm) | 0.15mm |
| Min Line Space(mm) | 0.15mm |
| Solder Mask | Girinhi |
| Legend Color | Chena |
| Mechanical processing | V-kurovera, CNC Milling (routing) |
| Packing | Anti-static bag |
| E-test | Flying probe kana Fixture |
| Kubvuma mwero | IPC-A-600H Kirasi 2 |
| Application | Zvemagetsi zvemotokari |
Nhanganyaya
Rigid & flex pcbs inosanganiswa nemapuranga akaoma kugadzira ichi chigadzirwa chehybrid.Mamwe maturu ekugadzira maitiro anosanganisira inoshanduka sedunhu inomhanya nepakati pemabhodhi akaomarara, akafanana
yakajairwa hardboard redunhu dhizaini.
Mugadziri webhodhi anozowedzera akaputirwa nemaburi (PTHs) anobatanidza akaomarara uye anochinjika maseketi sechikamu cheichi chiitiko.Iyi PCB yaive yakakurumbira nekuda kwehungwaru hwayo, huchokwadi, uye kuchinjika.
Rigid-Flex PCBs inorerutsa dhizaini yemagetsi nekubvisa tambo dzinochinjika, zvinongedzo, uye wiring yega.A Rigid&Flex mabhodhi sedunhu akanyanya kubatanidzwa mune iyo bhodhi chimiro chese, icho chinovandudza kushanda kwemagetsi.
Mainjiniya anogona kutarisira kuchengetedza zvirinani uye kushanda kwemagetsi nekuda kweiyo yakaomesesa-flex PCB yemukati magetsi uye mechaniki yekubatanidza.
Material
Substrate Zvishandiso
Chinhu chinonyanya kufarirwa chakaomarara-ex chinhu chakarukwa chefiberglass.Iyo yakakora ye epoxy resin inopfeka iyi fiberglass.
Zvakadaro, epoxy-impregnated fiberglass haina chokwadi.Haikwanise kumirisana nekukatyamadzwa uye kwakasimba.
Polyimide
Nyaya iyi inosarudzwa nokuda kwekushanduka kwayo.Iyo yakasimba uye inogona kumira kuvhunduka uye kufamba.
Polyimide inogonawo kumira kupisa.Izvi zvinoita kuti ive yakanaka kune maapplication ane tembiricha kuchinja.
Polyester (PET)
PET inofarirwa nehunhu hwayo hwemagetsi uye kuchinjika.Inopikisa makemikari uye kunyorova.Saka inogona kushandiswa mumamiriro ezvinhu akaoma eindasitiri.
Kushandisa substrate yakakodzera kunovimbisa simba rinodiwa uye hupenyu hurefu.Inotarisa zvinhu senge tembiricha kuramba uye kugadzikana kwe dimension uchisarudza substrate.
Polyimide Adhesives
Iyo tembiricha elasticity yeadhesive iyi inoita kuti ive yakanaka kune basa.Inogona kumira 500°C.Kupisa kwayo kwakanyanya kupisa kunoita kuti ive yakakodzera kune zvakasiyana-siyana zvakakosha zvinoshandiswa.
Polyester Adhesives
Aya anonamira anonyanya kuchengetedza mutengo pane anonamira e polyimide.
Iwo akakura pakugadzira basic rigid kuputika proof maseketi.
Ukama hwavo haunawo simba.Polyester adhesives zvakare haidziviri kupisa.Vakagadziridzwa munguva pfupi yapfuura.Izvi zvinovapa nekudzivirira kupisa.Shanduko iyi inosimudzirawo kugadzirisa.Izvi zvinovaita vakachengeteka mumultilayer PCB musangano.
Acrylic Adhesives
Aya anonamira ari epamusoro.Ivo vane yakanakisa thermal kugadzikana kurwisa ngura uye makemikari.Zviri nyore kushandisa uye hazvidhure.Yakasanganiswa nekuwanikwa kwavo, ivo vanozivikanwa pakati pevagadziri.vagadziri.
Epoxies
Iyi ingangove ndiyo inonyanya kushandiswa adhesive mune rigid-flex redunhu kugadzira.Vanogonawo kutsungirira ngura uye tembiricha yepamusoro uye yakaderera.
Iwo zvakare anochinjika zvakanyanya uye anonamira akagadzikana.Iine polyester shoma mairi inoita kuti iwedzere kushanduka.
Stack-up
Iyo stack-up ye-rigid-ex PCB ndechimwe chezvakawanda zvikamu panguva
yakaoma-ex PCB yekugadzira uye yakanyanya kuomarara kupfuura yakajairwa
mabhodhi akaomarara, ngatitarisei kune mana akaturikidzana e-rigid-ex PCB sepazasi:
Pamusoro solder mask
Top layer
Dielectric 1
Signal layer 1
Dielectric 3
Signal layer 2
Dielectric 2
Pazasi layer
Pasi soldermask
PCB Kukwanisa
| Rigid board capacity | |
| Nhamba yezvikamu: | 1-42 layers |
| Material: | FR4\yakakwirira TG FR4\Lead yemahara zvinhu\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
| Kunze layer Cu ukobvu: | 1-6OZ |
| Inner layer Cu ukobvu: | 1-4OZ |
| Maximum processing area: | 610*1100mm |
| Minimum board ukobvu: | 2 akaturikidzana 0.3mm (12mil) 4 akaturikidzana 0.4mm (16mil) 6 akaturikidzana 0.8mm (32mil) 8 akaturikidzana 1.0mm (40mil) 10 akaturikidzana 1.1mm (44mil) 12 akaturikidzana 1.3mm (52mil) 14 akaturikidzana 1.5mm (59mil) 16 akaturikidzana 1.6mm (63mil) |
| Minimum Width: | 0.076mm (3mil) |
| Minimum Space: | 0.076mm (3mil) |
| Saizi shoma yegomba (gomba rekupedzisira): | 0.2mm |
| Aspect ratio: | 10:1 |
| Kuchera gomba saizi: | 0.2-0.65mm |
| Drilling tolerance: | +\-0.05mm(2mil) |
| PTH kushivirira: | Φ0.2-1.6mm +\-0.075mm (3mil) Φ1.6-6.3mm+\-0.1mm(4mil) |
| NPTH kushivirira: | Φ0.2-1.6mm +\-0.05mm(2mil) Φ1.6-6.3mm+\-0.05mm(2mil) |
| Pedzisa bhodhi kushivirira: | Ukobvu＜0.8mm, Kushivirira:+/-0.08mm |
| 0.8mm≤Kukora≤6.5mm,Kushivirira+/-10% | |
| Minimum soldermask bhiriji: | 0.076mm (3mil) |
| Kupeta uye kukotama: | ≤0.75% Min0.5% |
| Nhamba yeTG: | 130-215 ℃ |
| Impedans kushivirira: | +/-10%, Maminitsi+/-5% |
| Surface Treatment: | HASL, LF HASL |
| Kunyudza Goridhe, Flash Goridhe, Chigunwe cheGoridhe | |
| Kunyudza Sirivha, Kunyudza Tin,OSP | |
| Kusarudza Goridhe Plating, Goridhe ukobvu kusvika ku3um (120u") | |
| Carbon Print, Peelable S/M,ENEPIG | |
| Aluminium board kugona | |
| Nhamba yezvikamu: | Single layer, double layer |
| Maximum board size: | 1500 * 600mm |
| Board ukobvu: | 0.5-3.0mm |
| Copper ukobvu: | 0.5-4oz |
| Minimum gole size: | 0.8mm |
| Minimum width: | 0.1mm |
| Nzvimbo shoma: | 0.12mm |
| Minimum pad size: | 10 micron |
| Surface finish: | HASL,OSP,ENIG |
| Shaping: | CNC, Kurova, V-kucheka |
| Equipement: | Universal Tester |
| Flying Probe Open / Short Tester | |
| High simba Microscope | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit NePolisher | |
| FPC Kukwanisa | |
| Layer: | 1-8 zvikamu |
| Board ukobvu: | 0.05-0.5mm |
| Copper ukobvu: | 0.5-3OZ |
| Minimum Width: | 0.075mm |
| Nzvimbo shoma: | 0.075mm |
| Saizi yegomba: | 0.2mm |
| Minimum laser gomba saizi: | 0.075mm |
| Minimum punching gomba size: | 0.5mm |
| Soldermask kushivirira: | +\-0.5mm |
| Minimum routing dimension tolerance: | +\-0.5mm |
| Surface finish: | HASL,LF HASL,Silver Kunyudzwa,Immersion Gold,Flash Gold, OSP |
| Shaping: | Kubaya, Laser, Cheka |
| Equipement: | Universal Tester |
| Flying Probe Open / Short Tester | |
| High simba Microscope | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit NePolisher | |
| Rigid & flex simba | |
| Layer: | 1-28 layers |
| Rudzi rwezvinhu: | FR-4(Yakakwira Tg, Halogen Yemahara, Yakakwirira Frequency) PTFE, BT, Getek, Aluminium base, Copper base, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Board ukobvu: | 6-240mil/0.15-6.0mm |
| Copper ukobvu: | 210um (6oz) yemukati layer 210um (6oz) yekunze layer |
| Min mechanical drill size: | 0.2mm/0.08” |
| Aspect ratio: | 2:1 |
| Saizi huru yepaneru: | Sigle divi kana mativi maviri: 500mm * 1200mm |
| Multilayer layers:508mm X 610mm (20″ X 24″) | |
| Min mutsara wakafara/nzvimbo: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
| Via hole type: | Bofu / Akavigwa / Akavharirwa(VOP,VIP…) |
| HDI / Microvia: | EHE |
| Surface finish: | HASL, LF HASL |
| Kunyudza Goridhe, Flash Goridhe, Chigunwe cheGoridhe | |
| Kunyudza Sirivha, Kunyudza Tin,OSP | |
| Kusarudza Goridhe Plating, Goridhe ukobvu kusvika ku3um (120u") | |
| Carbon Print, Peelable S/M,ENEPIG | |
| Shaping: | CNC, Kurova, V-kucheka |
| Equipement: | Universal Tester |
| Flying Probe Open / Short Tester | |
| High simba Microscope | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit NePolisher | |
