manfactyre

Nehupenyu hwemodemu uye teknolojia inoshanduka, kana vanhu vakabvunzwa nezvekuda kwavo kwenguva refu kwemagetsi, havazeze kupindura mazwi anotevera anokosha: maduku, akareruka, anokurumidza, anoshanda.Kuti ugadzirise zvigadzirwa zvemagetsi zvemazuva ano kune izvi zvinodiwa, tekinoroji yakadhindwa yedunhu redunhu yakaunzwa uye yakashandiswa zvakanyanya, pakati peiyo PoP (Package paPackage) tekinoroji yakawana mamirioni evatsigiri.

Package paPackage

Package paPackage ndiyo chaizvo maitiro ekurongedza zvinhu kana maICs (Integrated Circuits) pane mamaboard.Senzira yekurongedza yepamberi, PoP inobvumira kubatanidzwa kweakawanda ICs mupakeji imwe chete, ine logic uye ndangariro mumapakeji epamusoro uye epasi, kuwedzera kuchengetedza density nekuita uye kuderedza nzvimbo yekukwira.PoP inogona kukamurwa kuita zvimiro zviviri: chiyero chimiro uye TMV chimiro.Zvimiro zvakajairwa zvine logic zvishandiso mupazasi pasuru uye ndangariro zvishandiso kana akaturikidzana ndangariro mupasuru yepamusoro.Seyakakwidziridzwa vhezheni yePoP yakajairwa chimiro, iyo TMV (Kuburikidza neMold Via) chimiro chinoona kubatana kwemukati pakati peiyo logic mudziyo uye ndangariro mudziyo kuburikidza ne mold kuburikidza neburi repazasi pasuru.

Package-on-package inosanganisira maviri akakosha matekinoroji: pre-yakarongedzerwa PoP uye pa-bhodhi yakaturikidzana PoP.Musiyano mukuru pakati pavo ndewehuwandu hwekudzokazve: yekutanga inopfuura nepakati mbiri, nepo iyo yekupedzisira inopfuura kamwe chete.

Kubatsira kwePOP

Tekinoroji yePoP iri kushandiswa zvakanyanya neOEMs nekuda kwemabhenefiti ayo anoshamisa:

• Flexibility - Stacking chimiro chePoP chinopa maOEM akadai akawanda akasarudzika ekuturikidzana zvekuti ivo vanokwanisa kugadzirisa mashandiro ezvigadzirwa zvavo zviri nyore.

• Kuderedza saizi yose

• Kuderedza mutengo wose

• Kuderedza motherboard kuoma

• Kuvandudza hurongwa hwekugadzirisa zvinhu

• Kunatsiridza tekinoroji yekushandisa zvakare mwero