Rigid board capacity | |
Nhamba yezvikamu: | 1-42 layers |
Material: | FR4\yakakwirira TG FR4\Lead yemahara zvinhu\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
Kunze layer Cu ukobvu: | 1-6OZ |
Inner layer Cu ukobvu: | 1-4OZ |
Maximum processing area: | 610*1100mm |
Minimum board ukobvu: | 2 akaturikidzana 0.3mm (12mil) |
4 akaturikidzana 0.4mm (16mil) | |
6 akaturikidzana 0.8mm (32mil) | |
8 akaturikidzana 1.0mm (40mil) | |
10 akaturikidzana 1.1mm (44mil) | |
12 akaturikidzana 1.3mm (52mil) | |
14 akaturikidzana 1.5mm (59mil) | |
16 akaturikidzana 1.6mm (63mil) | |
Minimum Width: | 0.076mm (3mil) |
Minimum Space: | 0.076mm (3mil) |
Saizi shoma yegomba (gomba rekupedzisira): | 0.2mm |
Aspect ratio: | 10:01 |
Kuchera gomba saizi: | 0.2-0.65mm |
Drilling tolerance: | +\-0.05mm(2mil) |
PTH kushivirira: | Φ0.2-1.6mm +\-0.075mm (3mil) |
Φ1.6-6.3mm+\-0.1mm(4mil) | |
NPTH kushivirira: | Φ0.2-1.6mm +\-0.05mm(2mil) |
Φ1.6-6.3mm+\-0.05mm(2mil) | |
Pedzisa bhodhi kushivirira: | Ukobvu<0.8mm, Kushivirira:+/-0.08mm |
0.8mm≤Kukora≤6.5mm,Kushivirira+/-10% | |
Minimum soldermask bhiriji: | 0.076mm (3mil) |
Kupeta uye kukotama: | ≤0.75% Min0.5% |
Nhamba yeTG: | 130-215 ℃ |
Impedans kushivirira: | +/-10%, Maminitsi+/-5% |
Surface Treatment: | HASL, LF HASL |
Kunyudza Goridhe, Flash Goridhe, Chigunwe cheGoridhe | |
Kunyudza Sirivha, Kunyudza Tin,OSP | |
Kusarudza Goridhe Plating, Goridhe ukobvu kusvika ku3um (120u") | |
Carbon Print, Peelable S/M,ENEPIG | |
Aluminium board kugona | |
Nhamba yezvikamu: | Single layer, double layer |
Maximum board size: | 1500 * 600mm |
Board ukobvu: | 0.5-3.0mm |
Copper ukobvu: | 0.5-4oz |
Minimum gole size: | 0.8mm |
Minimum width: | 0.1mm |
Nzvimbo shoma: | 0.12mm |
Minimum pad size: | 10 micron |
Surface finish: | HASL,OSP,ENIG |
Shaping: | CNC, Kurova, V-kucheka |
Equipement: | Universal Tester |
Flying Probe Open / Short Tester | |
High simba Microscope | |
Solderability Testing Kit | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit NePolisher | |
FPC Kukwanisa | |
Layer: | 1-8 zvikamu |
Board ukobvu: | 0.05-0.5mm |
Copper ukobvu: | 0.5-3OZ |
Minimum Width: | 0.075mm |
Nzvimbo shoma: | 0.075mm |
Saizi yegomba: | 0.2mm |
Minimum laser gomba saizi: | 0.075mm |
Minimum punching gomba size: | 0.5mm |
Soldermask kushivirira: | +\-0.5mm |
Minimum routing dimension tolerance: | +\-0.5mm |
Surface finish: | HASL,LF HASL,Silver Kunyudzwa,Immersion Gold,Flash Gold, OSP |
Shaping: | Kubaya, Laser, Cheka |
Equipement: | Universal Tester |
Flying Probe Open / Short Tester | |
High simba Microscope | |
Solderability Testing Kit | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit NePolisher | |
Rigid & flex simba | |
Layer: | 1-28 layers |
Rudzi rwezvinhu: | FR-4(Yakakwira Tg, Halogen Yemahara, Yakakwirira Frequency) |
PTFE, BT, Getek, Aluminium base, Copper base, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | |
Board ukobvu: | 6-240mil/0.15-6.0mm |
Copper ukobvu: | 210um (6oz) yemukati layer 210um (6oz) yekunze layer |
Min mechanical drill size: | 0.2mm/0.08” |
Aspect ratio: | 2:01 |
Saizi huru yepaneru: | Sigle divi kana mativi maviri: 500mm * 1200mm |
Multilayer layers:508mm X 610mm (20″ X 24″) | |
Min mutsara wakafara/nzvimbo: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
Via hole type: | Bofu / Akavigwa / Akavharirwa(VOP,VIP…) |
HDI / Microvia: | EHE |
Surface finish: | HASL, LF HASL |
Kunyudza Goridhe, Flash Goridhe, Chigunwe cheGoridhe | |
Kunyudza Sirivha, Kunyudza Tin,OSP | |
Kusarudza Goridhe Plating, Goridhe ukobvu kusvika ku3um (120u") | |
Carbon Print, Peelable S/M,ENEPIG | |
Shaping: | CNC, Kurova, V-kucheka |
Equipement: | Universal Tester |
Flying Probe Open / Short Tester | |
High simba Microscope | |
Solderability Testing Kit | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit NePolisher |
Nguva yekutumira: Sep-05-2022