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Rigid board capacity
Nhamba yezvikamu: 1-42 layers
Material: FR4\yakakwirira TG FR4\Lead yemahara zvinhu\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers
Kunze layer Cu ukobvu: 1-6OZ
Inner layer Cu ukobvu: 1-4OZ
Maximum processing area: 610*1100mm
Minimum board ukobvu: 2 akaturikidzana 0.3mm (12mil)
4 akaturikidzana 0.4mm (16mil)
6 akaturikidzana 0.8mm (32mil)
8 akaturikidzana 1.0mm (40mil)
10 akaturikidzana 1.1mm (44mil)
12 akaturikidzana 1.3mm (52mil)
14 akaturikidzana 1.5mm (59mil)
16 akaturikidzana 1.6mm (63mil)
Minimum Width: 0.076mm (3mil)
Minimum Space: 0.076mm (3mil)
Saizi shoma yegomba (gomba rekupedzisira): 0.2mm
Aspect ratio: 10:01
Kuchera gomba saizi: 0.2-0.65mm
Drilling tolerance: +\-0.05mm(2mil)
PTH kushivirira: Φ0.2-1.6mm +\-0.075mm (3mil)
Φ1.6-6.3mm+\-0.1mm(4mil)
NPTH kushivirira: Φ0.2-1.6mm +\-0.05mm(2mil)
Φ1.6-6.3mm+\-0.05mm(2mil)
Pedzisa bhodhi kushivirira: Ukobvu<0.8mm, Kushivirira:+/-0.08mm
0.8mm≤Kukora≤6.5mm,Kushivirira+/-10%
Minimum soldermask bhiriji: 0.076mm (3mil)
Kupeta uye kukotama: ≤0.75% Min0.5%
Nhamba yeTG: 130-215 ℃
Impedans kushivirira: +/-10%, Maminitsi+/-5%
Surface Treatment: HASL, LF HASL
     Kunyudza Goridhe, Flash Goridhe, Chigunwe cheGoridhe
Kunyudza Sirivha, Kunyudza Tin,OSP
Kusarudza Goridhe Plating, Goridhe ukobvu kusvika ku3um (120u")
Carbon Print, Peelable S/M,ENEPIG
Aluminium board kugona
Nhamba yezvikamu: Single layer, double layer
Maximum board size: 1500 * 600mm
Board ukobvu: 0.5-3.0mm
Copper ukobvu: 0.5-4oz
Minimum gole size: 0.8mm
Minimum width: 0.1mm
Nzvimbo shoma: 0.12mm
Minimum pad size: 10 micron
Surface finish: HASL,OSP,ENIG
Shaping: CNC, Kurova, V-kucheka
Equipement: Universal Tester
Flying Probe Open / Short Tester
High simba Microscope
Solderability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit NePolisher
FPC Kukwanisa
Layer: 1-8 zvikamu
Board ukobvu: 0.05-0.5mm
Copper ukobvu: 0.5-3OZ
Minimum Width: 0.075mm
Nzvimbo shoma: 0.075mm
Saizi yegomba: 0.2mm
Minimum laser gomba saizi: 0.075mm
Minimum punching gomba size: 0.5mm
Soldermask kushivirira: +\-0.5mm
Minimum routing dimension tolerance: +\-0.5mm
Surface finish: HASL,LF HASL,Silver Kunyudzwa,Immersion Gold,Flash Gold, OSP
Shaping: Kubaya, Laser, Cheka
Equipement: Universal Tester
Flying Probe Open / Short Tester
High simba Microscope
Solderability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit NePolisher
Rigid & flex simba
Layer: 1-28 layers
Rudzi rwezvinhu: FR-4(Yakakwira Tg, Halogen Yemahara, Yakakwirira Frequency)
PTFE, BT, Getek, Aluminium base, Copper base, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon
Board ukobvu: 6-240mil/0.15-6.0mm
Copper ukobvu: 210um (6oz) yemukati layer 210um (6oz) yekunze layer
Min mechanical drill size: 0.2mm/0.08”
Aspect ratio: 2:01
Saizi huru yepaneru: Sigle divi kana mativi maviri: 500mm * 1200mm
Multilayer layers:508mm X 610mm (20″ X 24″)
Min mutsara wakafara/nzvimbo: 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil
Via hole type: Bofu / Akavigwa / Akavharirwa(VOP,VIP…)
HDI / Microvia: EHE
Surface finish: HASL, LF HASL
Kunyudza Goridhe, Flash Goridhe, Chigunwe cheGoridhe
Kunyudza Sirivha, Kunyudza Tin,OSP
Kusarudza Goridhe Plating, Goridhe ukobvu kusvika ku3um (120u")
Carbon Print, Peelable S/M,ENEPIG
Shaping: CNC, Kurova, V-kucheka
Equipement: Universal Tester
Flying Probe Open / Short Tester
High simba Microscope
Solderability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit NePolisher

 


Nguva yekutumira: Sep-05-2022