Delivery Capacity
| Rigid board capacity | |
| Nhamba yezvikamu: | 1-42 layers |
| Material: | FR4\yakakwirira TG FR4\Lead yemahara zvinhu\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
| Kunze layer Cu ukobvu: | 1-6OZ |
| Inner layer Cu ukobvu: | 1-4OZ |
| Maximum processing area: | 610*1100mm |
| Minimum board ukobvu: | 2 akaturikidzana 0.3mm (12mil) 4 akaturikidzana 0.4mm (16mil) 6 akaturikidzana 0.8mm (32mil) 8 akaturikidzana 1.0mm (40mil) 10 akaturikidzana 1.1mm (44mil) 12 akaturikidzana 1.3mm (52mil) 14 akaturikidzana 1.5mm (59mil) 16 akaturikidzana 1.6mm (63mil) |
| Minimum Width: | 0.076mm (3mil) |
| Minimum Space: | 0.076mm (3mil) |
| Saizi shoma yegomba (gomba rekupedzisira): | 0.2mm |
| Aspect ratio: | 10:1 |
| Kuchera gomba saizi: | 0.2-0.65mm |
| Drilling tolerance: | +\-0.05mm(2mil) |
| PTH kushivirira: | Φ0.2-1.6mm +\-0.075mm (3mil) Φ1.6-6.3mm+\-0.1mm(4mil) |
| NPTH kushivirira: | Φ0.2-1.6mm +\-0.05mm(2mil) Φ1.6-6.3mm+\-0.05mm(2mil) |
| Pedzisa bhodhi kushivirira: | Ukobvu＜0.8mm, Kushivirira:+/-0.08mm |
| 0.8mm≤Kukora≤6.5mm,Kushivirira+/-10% | |
| Minimum soldermask bhiriji: | 0.076mm (3mil) |
| Kupeta uye kukotama: | ≤0.75% Min0.5% |
| Nhamba yeTG: | 130-215 ℃ |
| Impedans kushivirira: | +/-10%, Maminitsi+/-5% |
| Surface Treatment:
| HASL, LF HASL |
| Kunyudza Goridhe, Flash Goridhe, Chigunwe cheGoridhe | |
| Kunyudza Sirivha, Kunyudza Tin,OSP | |
| Kusarudza Goridhe Plating, Goridhe ukobvu kusvika ku3um (120u") | |
| Carbon Print, Peelable S/M,ENEPIG | |
| Aluminium board kugona | |
| Nhamba yezvikamu: | Single layer, double layer |
| Maximum board size: | 1500 * 600mm |
| Board ukobvu: | 0.5-3.0mm |
| Copper ukobvu: | 0.5-4oz |
| Minimum gole size: | 0.8mm |
| Minimum width: | 0.1mm |
| Nzvimbo shoma: | 0.12mm |
| Minimum pad size: | 10 micron |
| Surface finish: | HASL,OSP,ENIG |
| Shaping: | CNC, Kurova, V-kucheka |
| Equipement: | Universal Tester |
| Flying Probe Open / Short Tester | |
| High simba Microscope | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit NePolisher | |
| FPC Kukwanisa | |
| Layer: | 1-8 zvikamu |
| Board ukobvu: | 0.05-0.5mm |
| Copper ukobvu: | 0.5-3OZ |
| Minimum Width: | 0.075mm |
| Nzvimbo shoma: | 0.075mm |
| Saizi yegomba: | 0.2mm |
| Minimum laser gomba saizi: | 0.075mm |
| Minimum punching gomba size: | 0.5mm |
| Soldermask kushivirira: | +\-0.5mm |
| Minimum routing dimension tolerance: | +\-0.5mm |
| Surface finish: | HASL,LF HASL,Silver Kunyudzwa,Immersion Gold,Flash Gold, OSP |
| Shaping: | Kubaya, Laser, Cheka |
| Equipement: | Universal Tester |
| Flying Probe Open / Short Tester | |
| High simba Microscope | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit NePolisher | |
| Rigid & flex simba | |
| Layer: | 1-28 layers |
| Rudzi rwezvinhu: | FR-4(Yakakwira Tg, Halogen Yemahara, Yakakwirira Frequency) PTFE, BT, Getek, Aluminium base, Copper base, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Board ukobvu: | 6-240mil/0.15-6.0mm |
| Copper ukobvu: | 210um (6oz) yemukati layer 210um (6oz) yekunze layer |
| Min mechanical drill size: | 0.2mm/0.08” |
| Aspect ratio: | 2:1 |
| Saizi huru yepaneru: | Sigle divi kana mativi maviri: 500mm * 1200mm |
| Multilayer layers:508mm X 610mm (20″ X 24″) | |
| Min mutsara wakafara/nzvimbo: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
| Via hole type: | Bofu / Akavigwa / Akavharirwa(VOP,VIP…) |
| HDI / Microvia: | EHE |
| Surface finish: | HASL, LF HASL |
| Kunyudza Goridhe, Flash Goridhe, Chigunwe cheGoridhe | |
| Kunyudza Sirivha, Kunyudza Tin,OSP | |
| Kusarudza Goridhe Plating, Goridhe ukobvu kusvika ku3um (120u") | |
| Carbon Print, Peelable S/M,ENEPIG | |
| Shaping: | CNC, Kurova, V-kucheka |
| Equipement: | Universal Tester |
| Flying Probe Open / Short Tester | |
| High simba Microscope | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit NePolisher | |
