Products
4 layer FPC ine FR4 stiffener mu 4G module system
| Layer | 4 layers inochinjika |
| Board ukobvu | 0.2mm |
| Material | Polymide |
| Mhangura ukobvu | 1 OZ(35um) |
| Surface Finish | ENIG Au Ukobvu 1um;Ni Ukobvu 3um |
| Min Hole(mm) | 0.23mm |
| Min Line Width(mm) | 0.15mm |
| Min Line Space(mm) | 0.15mm |
| Solder Mask | Girinhi |
| Legend Color | Chena |
| Mechanical processing | V-kurovera, CNC Milling (routing) |
| Packing | Anti-static bag |
| E-test | Flying probe kana Fixture |
| Kubvuma mwero | IPC-A-600H Kirasi 2 |
| Application | Zvemagetsi zvemotokari |
Nhanganyaya
A flex PCB imhando yakasarudzika yePCB yaunogona kukotama kuita yaunoda chimiro.Iwo anowanzo shandiswa kune yakakwira density uye yakakwirira tembiricha mashandiro.
Nekuda kwekunaka kwayo kupisa kwekudzivirira, iyo inochinjika dhizaini yakanakira solder mounting components.Iyo yakajeka polyester firimu rinoshandiswa mukugadzira iyo flex dhizaini inoshanda seiyo substrate zvinhu.
Unogona kugadzirisa ukobvu hwemhangura kubva 0.0001 ″ kusvika 0.010 ″, nepo dielectric zvinhu zvingave pakati pe0.0005 ″ uye 0.010 ″ gobvu.Mashoma anobatana mune inochinjika dhizaini.
Naizvozvo, kune mashoma soldered zvinongedzo.Pamusoro pezvo, maseketi aya anotora chete 10% yenzvimbo yakaoma yebhodhi
nekuda kwekuchinjika kwavo bendability.
Material
Zvinhu zvinochinjika uye zvinofambiswa zvinoshandiswa kugadzira maPCB anochinjika.Kuchinjika kwayo kunobvumira kuti itendeuke kana kutamiswa pasina kukuvara kusingadzoreki kune zvikamu zvayo kana zvinongedzo.
Chese chikamu che flex PCB chinofanira kushanda pamwechete kuti chishande.Iwe unozoda zvinhu zvakasiyana-siyana kuunganidza flex board.
Kuvhara Layer Substrate
Conductor carrier uye insulating medium inosarudza basa re substrate uye firimu.Uyezve, iyo substrate inofanirwa kukwanisa kukotama uye kupeta.
Polyimide uye polyester mapepa anowanzo shandiswa mumaseketi anochinjika.Aya angori mashoma emafirimu mazhinji epolymer aungawana, asi kune akawanda akawanda ekusarudza kubva.
Icho chiri nani sarudzo nekuda kwemutengo wakaderera uye yakakwirira mhando substrate.
PI polyimide ndiyo inonyanya kushandiswa zvinhu nevagadziri.Iyi mhando ye thermostatic resin inogona kuramba tembiricha yakanyanyisa.Saka kunyungudika harisi dambudziko.Mushure mekupisa kwepolymerization, ichiri kuchengetedza elasticity uye kuchinjika.Mukuwedzera kune izvi, ine zvinhu zvakanakisa zvemagetsi.
Conductor Materials
Iwe unofanirwa kusarudza iyo conductor element inotamisa simba zvakanyanya.Anenge ese maseketi ekudzivirira kuputika anoshandisa mhangura seyekutanga conductor.
Kunze kwokuva kondakita akanaka zvikuru, mhangura iri nyorewo kuwana.Kuenzaniswa nemutengo wezvimwe zvinhu zvekondukita, mhangura inotengeswa.Conductivity haina kukwana kuti iparadze kupisa zvakanaka;inofanirawo kuva yakanaka thermal conductor.Flexible circuits inogona kugadzirwa uchishandisa zvinhu zvinoderedza kupisa kwavanoita.
Adhesives
Pane chinonamira pakati pepepa re polyimide nemhangura pane chero flex redunhu bhodhi.Epoxy uye acrylic ndiwo maviri makuru ekunamira aunogona kushandisa.
Kunamira kwakasimba kunodiwa kubata kudziya kwepamusoro kunogadzirwa nemhangura.
